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NVIDIA B300

Blackwell Ultra data center GPU built for AI reasoning, large-scale inference, and trillion-parameter model training.

Release

2025

GPU Class

Data Center / AI Accelerator

Architecture

Blackwell Ultra

PRICE SNAPSHOT

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On-premise Module

Turnkey System

Cloud Pricing
(per GPU/hr)

chip identity

nvidia-b300

On-premise Module

GPU Class

Data Center / AI Accelerator

Release

2025

Architecture

Blackwell Ultra

Target Workload

  • AI Reasoning and Agentic AI Inference
  • LLM Training (1T+ parameters)
  • Long-context and Mixture-of-Experts (MoE) Models

Compatible Platforms

  • DGX B300 systems
  • HGX B300 baseboards
  • GB300 NVL72 rack-scale systems
  • Custom AI clusters via OEM

Ideal Buyer Profile

Enterprises and research organizations requiring:

  • Maximum per-GPU memory to keep full models resident without sharding
  • High-concurrency, low-latency inference for reasoning models
  • Rack-scale NVLink clusters for frontier model training

Typical adopters include AI cloud platforms, hyperscalers, frontier AI labs, and enterprises serving large reasoning models in production.

Availability Notes

The B300 was announced at GTC in March 2025 as the mid-cycle refresh of Blackwell, with systems shipping from the second half of 2025. It sits above the B200 as NVIDIA's top Blackwell GPU and serves as the bridge to the Rubin generation. Most deployments are liquid-cooled, and cloud capacity is commonly offered as 8-GPU HGX nodes or reserved cluster contracts.

Recent Developments

  • NVIDIA introduced the NVFP4 precision format with Blackwell Ultra, enabling 4-bit training and inference with accuracy close to FP8.
  • Blackwell Ultra Tensor Cores add 2x attention-layer acceleration, targeting transformer and reasoning workloads.
  • Software support continues to mature across TensorRT-LLM, NVIDIA Dynamo, vLLM, and SGLang.

overview

The NVIDIA B300 is the flagship GPU of NVIDIA's Blackwell Ultra generation, built to push AI inference and training beyond the original B200. It targets AI reasoning, agentic AI, and hyperscale generative AI workloads, where memory capacity and low-precision throughput matter most.

Key upgrades over the B200 include 288 GB of HBM3e memory (50% more), 50% more dense FP4 compute, 2x attention-layer acceleration, and a move to PCIe Gen 6. The tradeoff is a deliberate cut to FP64 and INT8 throughput, making the B300 an AI-first chip rather than a general HPC accelerator.

Key specifications

Specification B300 GPU
ArchitectureNVIDIA Blackwell Ultra
CUDA Cores20,480
Tensor Cores640 (5th Gen)
Streaming Multiprocessors160
Memory288 GB HBM3e (12-high stacks)
Memory Bandwidth8 TB/s
InterconnectNVLink 5 (multi-GPU)
NVLink (peer)1.8 TB/s bidirectional
Host InterfacePCIe Gen 6
Die-to-die LinkNV-HBI, 10 TB/s
Form FactorSXM (HGX), GB300 Superchip
Max TGPUp to ~1,400 W
Precision SupportNVFP4, FP4, FP6, FP8, FP16/BF16, TF32
FP64 and INT8 heavily reduced
Typical AI Compute15 PFLOPS dense FP4
Process NodeTSMC 4NP
Transistor Count208 billion (dual-die)
MIG SupportSupported

Performance Summary

  • AI/ML Throughput: 15 PFLOPS of dense NVFP4 per GPU, 1.5x the B200 and 7.5x the H100/H200.
  • Attention Acceleration: 2x faster attention-layer processing, which compounds with NVFP4 gains for LLM and multimodal inference.
  • Memory: 288 GB HBM3e at 8 TB/s per GPU, or about 2.3 TB per 8-GPU node, enough to hold very large models and KV caches entirely in GPU memory.
  • Multi-GPU Scaling: NVLink 5 at 1.8 TB/s per GPU, scaling to 72 GPUs in a single GB300 NVL72 NVLink domain.
  • HPC Note: FP64 drops to roughly 1.3 TFLOPS, far below the B200, so double-precision scientific workloads are better served by Hopper or B200.

primary use case

  • High-concurrency inference for reasoning models and agentic AI
  • Trillion-parameter LLM training and fine-tuning with FP4/FP8 precision
  • Long-context workloads (128K+ tokens) with large KV caches
  • Mixture-of-Experts models that benefit from keeping all expert weights in memory
  • Rack-scale AI factories built on GB300 NVL72 and DGX SuperPOD

Alternatives & Upgrade Path

Comparable NVIDIA GPUs:

  • B200: Original Blackwell flagship with 192 GB HBM3e, lower FP4 throughput, but much stronger FP64 for HPC.
  • H200 / H100: Previous-generation Hopper GPUs with lower memory and tensor performance, still strong for FP64 workloads.
  • Rubin (next gen): NVIDIA's successor architecture, positioned as the upgrade path beyond Blackwell Ultra.

Competitor GPUs:

  • AMD MI355X / MI325X: Competing high-memory accelerators, with the ROCm software ecosystem still trailing CUDA in maturity.

Related Chips & Providers

Related NVIDIA GPUs:

  • B200 (Blackwell)
  • HGX B300 multi-GPU boards
  • GB300 Grace Blackwell Ultra Superchip (one Grace CPU paired with two B300 GPUs)

Complementary Silicon:

  • Grace CPUs for tightly coupled CPU-GPU systems
  • ConnectX-8 SuperNICs for 800 Gb/s networking

SUMMARY

The NVIDIA B300 is the most capable GPU in the Blackwell family, combining 288 GB of HBM3e, 15 PFLOPS of dense FP4 compute, and accelerated attention processing in a single CUDA accelerator. It is purpose-built for the reasoning and inference era of AI, letting teams run larger models with fewer GPUs and lower latency. For organizations building AI factories or serving frontier models at scale, it is the current top tier of NVIDIA's data center lineup.

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