GPU
amd

AMD MI300X

CDNA 3–based high-memory data center GPU optimized for large-scale LLM inference and memory-bound AI workloads.

Release

2024

GPU Class

Data Center / AI Accelerator

Architecture

CDNA 3

PRICE SNAPSHOT

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On-premise Module

~$20k–$30k

Turnkey System

~$200k–$300k+

Cloud Pricing
(per GPU/hr)

~$1.80–$7+/hr

chip identity

AMD Instinct™ MI300X Accelerators

On-premise Module

MI300X

GPU Class

Data Center / AI Accelerator

Release

2024

Architecture

CDNA 3

Target Workload

- Large language model inference at scale

- Memory-intensive generative AI workloads

- Retrieval-augmented generation (RAG) pipelines

- LLM training and fine-tuning where memory capacity is the primary constraint

Compatible Platforms

  • OEM 8-GPU server platforms based on AMD Instinct MI300X
  • Custom AI clusters via OEM and system integrators
  • Hyperscale and cloud bare-metal GPU instances
  • Interconnect: Infinity Fabric (intra-node GPU connectivity via xGMI; no NVLink-equivalent fabric)
  • Software Stack: ROCm, HIP, PyTorch (ROCm), TensorFlow (ROCm), OpenAI Triton (ROCm support)

Ideal Buyer Profile

Enterprises and organizations requiring:

  • Very high GPU memory capacity to host large language models and inference caches on a single device
  • Cost-efficient scaling for large-scale, memory-bound AI inference workloads
  • Flexibility to deploy on OEM servers or bare-metal cloud platforms rather than proprietary turnkey systems
  • Willingness to operate within the ROCm software ecosystem for AI development and deployment

Typical adopters include cloud providers, AI service operators, and enterprises deploying large language model inference and RAG pipelines at scale, particularly where memory capacity and total cost of ownership are primary decision factors.

Availability Notes

he MI300X is available through OEM server vendors, system integrators, and select cloud providers rather than as a standalone, AMD-branded turnkey system. It is most commonly deployed in 4- or 8-GPU server configurations using PCIe Gen5 and high-speed networking for scale-out workloads. Availability, configuration options, and pricing vary significantly by vendor, region, and volume, reflecting its positioning as a data center–focused accelerator rather than a retail or workstation GPU.

Recent Developments

  • AMD positioned the MI300X as a high-memory alternative to leading NVIDIA data center GPUs, emphasizing inference performance and total cost efficiency for large language models.
  • Major OEMs expanded support for MI300X-based server platforms, enabling broader enterprise and cloud deployment options.
  • Cloud providers continued to introduce MI300X bare-metal and virtualized instances targeted at large-scale LLM inference workloads.
  • Ongoing software improvements in the ROCm ecosystem have focused on improving PyTorch compatibility, inference performance, and operational stability for production deployments.

overview

The AMD Instinct MI300X is a CDNA 3–generation data center GPU designed to address memory-bound AI workloads by providing very large on-package high-bandwidth memory for large language model inference and training. It integrates a single GPU compute die with stacked HBM3 memory to minimize memory access bottlenecks common in transformer-based models, particularly at large parameter counts and extended context lengths.

MI300X is deployed as a PCIe accelerator within OEM server platforms and cloud bare-metal instances rather than as an AMD-branded turnkey system. It typically appears in 4- or 8-GPU server configurations connected via PCIe Gen5 and system-level networking, forming the foundation of memory-optimized AI clusters used for large-scale inference and selected training workloads.

Key specifications

Specification MI300X GPU
Architecture AMD CDNA 3
Memory 192 GB HBM3
Memory Bandwidth ~5.3 TB/s (peak theoretical)
Interconnect Infinity Fabric scale-up links (7x 128 GB/s) for 8-GPU ring (platform-dependent)
Form Factor OAM module (typically deployed on UBB 2.0 platforms)
Max TGP 750 W (maximum TBP)
Precision Support FP64, FP32, FP16, BF16, FP8, INT8
Typical AI Compute TBD (vendor publishes peak metrics by precision; varies by mode and workload)
Process Node TSMC 5 nm (compute dies), 6 nm (I/O dies)
Transistor Count 153 billion
MIG Support SR-IOV, up to 8 partitions
NVLink (peer) Not supported

Performance Summary

  • AI/ML Throughput: Delivers competitive FP16, BF16, and FP8 performance for large-scale inference and selected training workloads; throughput advantages are most apparent in memory-bound LLM inference scenarios where large model states remain resident on GPU memory.
  • Tensor Compute: CDNA 3 matrix engines are optimized for FP16, BF16, FP8, and INT8 operations, supporting modern mixed-precision AI workflows without NVIDIA-specific Tensor Core features.
  • Memory Bandwidth: Very high HBM3 capacity and bandwidth (~5.3 TB/s) significantly reduce memory bottlenecks, enabling large batch sizes, long context windows, and high token throughput for inference-heavy workloads.
  • Multi-GPU Scaling: Scale-out relies on PCIe Gen5, Infinity Fabric links (platform-dependent), and high-speed networking rather than a dedicated NVLink-class fabric, making MI300X best suited to workloads that scale efficiently with data parallelism or network-based sharding.

Compared to NVIDIA H100 and H200, the MI300X emphasizes memory capacity and bandwidth over peak tensor compute, making it particularly effective for large language model inference and other memory-intensive AI workloads, while training scalability depends more heavily on system architecture and network performance.

primary use case

  • Large-scale LLM inference where very high GPU memory capacity allows full models and large KV caches to remain resident on device
  • Memory-bound generative AI workloads that benefit from high HBM bandwidth and reduced host memory access
  • Retrieval-augmented generation (RAG) pipelines with large embedding stores and frequent memory access
  • Batch-oriented inference serving for chat, search, and recommendation systems
  • Selective LLM training and fine-tuning where memory capacity is a larger constraint than inter-GPU fabric performance

Alternatives & Upgrade Path

Comparable GPUs:

  • NVIDIA H200: Hopper-generation GPU with lower memory capacity but stronger scale-up via NVLink; often preferred for mixed training and inference workloads that benefit from tight multi-GPU coupling.
  • NVIDIA H100: Earlier Hopper GPU with smaller HBM capacity; widely deployed but more constrained for large-model inference compared with MI300X.

Adjacent and Successor Options:

  • AMD Instinct MI300A: APU variant combining CPU and GPU in a single package, optimized for tightly coupled HPC and AI workloads rather than pure inference acceleration.
  • Next-generation AMD Instinct accelerators: Future CDNA-based parts are expected to build on MI300X’s high-memory positioning with improved interconnect and efficiency.

For organizations prioritizing maximum GPU memory per device and cost-efficient large-scale inference, MI300X is often evaluated as an alternative to H200. Buyers requiring stronger multi-GPU scale-up for training may favor NVIDIA platforms, while those already invested in AMD’s ROCm ecosystem can use MI300X as a foundation before transitioning to newer Instinct generations

Related Chips & Providers

Related AMD GPUs:

Competitor GPUs:

SUMMARY

The AMD Instinct MI300X is a CDNA 3–generation data center GPU designed around very high on-package memory capacity and bandwidth, making it particularly well suited for large-scale, memory-bound AI inference workloads. With 192 GB of HBM3 and a focus on cost-efficient deployment through OEM and cloud platforms, it offers a compelling alternative to NVIDIA accelerators for organizations prioritizing inference throughput and total cost of ownership. MI300X is typically deployed in multi-GPU servers and scale-out clusters, serving as a foundation for large language model inference and RAG pipelines rather than tightly coupled, scale-up training environments.

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